'Stay tuned' for an AMD Ryzen chip with 3D V-Cache on both chiplets

AMD has teased the launched of a new Ryzen processor with two chiplets, each of which will include a healthy dollop of 3D V-Cache.
Morning Overview on MSN

This new 3D chip could smash AI’s biggest bottleneck

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
Science Daily

Researchers demonstrate the first chip-based 3D printer

Researchers have demonstrated the first chip-based 3D printer, a tiny device that emits reconfigurable beams of visible light into a well of resin that rapidly cures into a solid shape. The advance ...
GIGAZINE

Successfully manufactured '3D chip' that is expected to significantly improve performance compared to existing 2D semiconductors

Instead of semiconductors with parts laid out on a flat surface, they developed a '3D chip' in which layers of parts are stacked vertically. This has resulted in significant improvements, such as a ...
Seeking Alpha

Intel: Pivotal Role In The 3D Chip Revolution

Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...
Electronic Design

Ansys Adds Another Dimension to the 3D Chip Design Process

The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...
Network World

TSMC May Beat Intel with World’s First 3D Chips

Taiwan Semiconductor Manufacturing Co. is vying with Intel to become the first company to sell three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 ...
Science Daily

Ultraprecise method of aligning 3D semiconductor chips invented

Researchers have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work can help to lower the cost ...
CNX Software

Rockchip RK1820/RK1828 SO-DIMM and M.2 LLM/VLM AI accelerator modules, devkits, and benchmarks

Rockchip unveiled two RK182X LLM/VLM accelerators at its developer conference last July, namely the RK1820 with 2.5GB RAM for ...
Electronic Design

Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
Just Auto

Tesla gets grant for multi-chip module with ic dies, sockets, cold plate

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...