It’s well known that advanced chips contain billions of transistors – this is an incredible, mind-blowing fact to be sure – but did you know that large-scale integrated chips (about the size of a ...
Interconnect delay has moved to the forefront as the limiting factor in IC performance, replacing a longtime concern with switching speeds. That concern was prompted by advancements in deep-submicron ...
We stand on the brink of a fundamental discontinuity in silicon process-technology unlike anything most of us have seen. For almost two decades, a period of time spanning many of our entire education ...
Reducing the parasitic capacitance between the gate metal and the source/drain contact of a transistor can decrease device switching delays. One way to reduce parasitic capacitance is to reduce the ...
As the technology node decreases, meeting inter-wire or coupling capacitance becomes extremely critical and challenging in SOC design. Shrinking technology node leads to increase in dielectric values, ...
July 14, 2013. Imec made several announcements at SEMICON West last week. The organization is collaborating with Dow Corning on 3-D IC packaging technologies, announced it developed a manganese ...
Interconnect delay has moved to the forefront as the limiting factor in IC performance, replacing a longtime concern with switching speeds. That concern was prompted by advancements in deep-submicron ...
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