SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...

What if manufacturing companies could pinpoint the exact cause of a defect the moment it occurs, preventing costly production delays and ensuring top-notch quality? Generative artificial intelligence ...

Electron diffraction is a powerful analytical technique used to study the atomic structure of materials. It involves the interaction of a beam of electrons with a crystalline sample, resulting in a ...

Semiconductor manufacturing creates a wealth of data – from materials, products, factory subsystems and equipment. But how do we best utilize that information to optimize processes and reach the goal ...

Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...

Amid the shift towards more complex chips at advanced nodes, many chipmakers are exploring or turning to advanced forms of machine learning to help solve some big challenges in IC production. A subset ...