Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...

Much has changed in IC packaging technology since the first real-time microfocus X-ray systems entered the inspection market nearly 20 years ago. The trend for high-density packaging is moving from ...

The value of chip-package codesign is well established. Complex parts with high-speed signals put more constraints on the design of both IC and package, and careful design is required to achieve ...