The CSIS American Innovation Project Blog brings together key perspectives on the geopolitical and technological challenges of the twenty-first century. Semiconductor Packaging is an extremely ...

Ottawa, Dec. 05, 2025 (GLOBE NEWSWIRE) -- According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang. Innolux has been developing FO-PLP ...

LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global semiconductor assembly equipment market is projected to grow to USD 5.04 billion by 2021, at a CAGR of ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

Market demand for silicon wafers, IC packaging leadframes, and other related process materials remains strong, and chipmaking materials distributors including Topco Scientific, Wah... Niching ...

In recent years, the semiconductor assembly and packaging industry, which has been known for its labor-intensive nature, has been facing talent shortages due to the issue of declining birth rates. To ...

In this article, the most common errors occurring at different stages of the semiconductor fabrication process and the strategies to mitigate them are discussed. The ever-growing complexity of the ...