Marktech Optoelectronics and manufacturing partner Optrans are introducing new transfer-moulded photodiode and LED packaging ...

CHUNAN, Taiwan--(BUSINESS WIRE)--TSLC Corporation, a vertically integrated LED system manufacturer, introduced the world’s first 0.49mm fine-pitch direct-lit display using 36 pixels-in-1 πLED package ...

Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, has introduced new chip-on-board (COB) LED package lineups, including small LES ...

LED arrays are gaining traction in the lighting world, where their ability to cram many LED emitters into a single small package makes them attractive for high-intensity lighting. Also referred to as ...

Toshiba is starting mass production of white LED packages that offer a cost-competitive alternative to current LED packaging options by eliminating the expensive sapphire substrate. Toshiba is ...