As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are ...

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The ...

As competition in high bandwidth memory (HBM) to boost artificial intelligence (AI) semiconductor performance intensifies, the core task has shifted from how small to make memory to how precisely to ...

Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...

Samsung Electronics is not only investing actively in the R&D and capacity expansion of high-bandwidth memory (HBM) technology, but also looking to broaden its market reach through customized one-stop ...

AUSTIN, Texas — LSI Logic Corp. has developed a form of wire bond packaging that places the bonding pads directly on top of the active I/O circuitry on the silicon. The move could extend the reach and ...

HANMI Semiconductor announced on the 3rd that it will participate in the 'Advanced Packaging Bonding Corporations Conference' on July 3-4, being the only one among domestic corporations. According to ...