Companies are still pursuing sustainable packaging strategies even though they’ve toned down public messaging about it, ...

DELRAY BEACH, Fla., Oct. 31, 2025 /PRNewswire/ -- The MEMS packaging substrate market is expected to grow from USD 2.40 billion in 2025 to USD 3.23 billion by 2030, at a CAGR of 6.1% according to a ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry ...

Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030. Save my User ID and Password Some subscribers prefer to save ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...